High-speed piezo actuation
0.20 ms minimum pulse time and up to 1,200 Hz continuous frequency.
Piezo Jet Valve
Aurexis Automation · AX-PJ
AX-PJ Precision Piezo Jet Valve
Fast piezo actuation for repeatable micro-dispensing and non-contact jetting.
- Minimum pulse time
- 0.20 ms
- Maximum continuous frequency
- 1,200 Hz
- Instantaneous frequency
- 2,000 Hz
- Listed service life
- >1.5 billion cycles
Product overview
Built around the process, not a generic platform.
The AX-PJ uses a piezo-ceramic actuator with adjustable pulse voltage and precise needle travel. Integrated temperature and stroke sensing support high-speed contact or non-contact micro-dispensing. The source manual lists a 0.2 mm deposit width, at least 99% consistency and a fully potted actuator design.
Engineering advantages
Designed for stable, maintainable production
Micro-deposit capability
Source manual lists 0.2 mm deposit width with at least 99% consistency.
Wide material window
Covers low-viscosity fluids through high-viscosity adhesive, including silver paste and solder paste.
Integrated process sensing
Temperature and stroke sensors support controlled operation.
Model-specific features
AX-PJ standard configuration
Standard-temperature micro-dispensing
Contact or non-contact piezo jetting for standard fluids up to 75 °C.
AX-PJ heated configuration
Heated hot-melt micro-dispensing
Heated fluid path for hot-melt fluids up to 210 °C.
Technical data
Model selection and performance
Model-level differences are separated below; shared and supplementary parameters follow the model cards.
Model-level specifications
AX-PJ standard configuration
- Pulse / frequency
- 0.20 ms minimum pulse; 1,200 Hz continuous; 2,000 Hz instantaneous
- Fluid / temperature
- Adhesives, silver paste and solder paste; standard fluid ≤75 °C
- Envelope / weight
- 85.5 × 14 × 52 mm; 178 g
AX-PJ heated configuration
- Pulse / frequency
- 0.20 ms minimum pulse; 1,200 Hz continuous; 2,000 Hz instantaneous
- Fluid / temperature
- Hot-melt fluid path; hot-melt fluid ≤210 °C
- Envelope / weight
- 85.5 × 14 × 52 mm; 178 g
Shared and supplementary parameters
| Dispensing mode | Contact and non-contact |
|---|---|
| Viscosity range | 1–1,000,000 mPa·s |
| Deposit consistency | >99% |
| Maximum supply pressure | 7.5 MPa |
| Mounting / feed | M4; conical feed, Luer or ID 4–8 mm tube; M10 × 1; 50–600 µm nozzle seat |
Applications & options
Typical applications
- Silver paste and solder-paste micro-deposits
- Electronic component bonding
- Fine-line and micro-dot adhesive processes
- High-speed non-contact production dispensing
Optional modules
Temperature-control package
Match standard adhesive or hot-melt operating range.
Feed adapter set
Configure conical feed, Luer or tube connection.
Nozzle seat and nozzle
Select from 50–600 µm interfaces after material testing.
Resources & support
Prepare the project with the right inputs
Delivery and service
Selection is confirmed against the workpiece, fluid, viscosity, deposit geometry and cycle requirement. Final specifications require engineering sign-off.
FAQ
Questions before selection
Which fluids can be used?
The source lists adhesives across a broad viscosity range, silver paste and solder paste; an actual-material test is still required.
What is the listed operating frequency?
The source lists 1,200 Hz maximum continuous frequency and 2,000 Hz instantaneous frequency.
Is the service-life value guaranteed?
The manual lists more than 1.5 billion cycles; project acceptance conditions must be defined separately.
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Send us your workpiece and process requirements.
We will confirm equipment configuration, fixtures, process modules and line interfaces.